Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can decrease void happened and optimizes the performance of manufacturing process. Our Bumping Solder Paste was well-developed to have 6 month shelf life and can be storage just less than 10 degree C.
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