BGA Sphere

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. BGA Sphere is available for customers’ specifications.



Diameter Tolerance
0.76mm~0.50mm ±20um
0.45mm~0.10mm ±10um

* Please contact us for other diameter and any requirement.


Additional information




There are no reviews yet.

Be the first to review “BGA Sphere”

Your email address will not be published. Required fields are marked *

Fanpage SHL VINA Send email to SHLVINA +84-(0)247 101 8688