DOWSIL™ SC 102 Compound (1KG/PAIL)

A white, non-curing and non-flowing, thermally conductive compound. Designed to provide efficient thermal transfer for the cooling of electronic modules used in computer, power supply, and automotive applications.

Danh mục: DOW SILICONE

TECHNICAL CONTENT

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These values are typical properties and are not intended for use in preparing specifications.

Adhesion to
Metal, Aluminum, Plastic, FR4, Ceramic
Color
White
Dielectric Strength
50 volts per mil v/mil
Dielectric Strength (kV/mm)
2 kV/mm
Flowable
Yes
Hydrophobic
Yes
Low Odor
Yes
Nonvolatile Content
99.7 %
Number of Parts
One

Polyesters
Yes
Primerless Adhesion
Primerless
Resistance Type
Oxidation Resistance, Ozone Resistance, Solvent Resistance, Thermal Resistance, UV Resistance, Water Resistance
Temperature Stable
High, Low
Thermal Conductivity
0.9 Watts per meter K
Volume Resistivity
2e+016 ohm-centimeters
Water Resistant
Yes