DOWSIL™ SC 102 Compound (1KG/PAIL)

A white, non-curing and non-flowing, thermally conductive compound. Designed to provide efficient thermal transfer for the cooling of electronic modules used in computer, power supply, and automotive applications.

Category:

Description

These values are typical properties and are not intended for use in preparing specifications.

  • Adhesion to
    Metal, Aluminum, Plastic, FR4, Ceramic
  • Color
    White
  • Dielectric Strength
    50 volts per mil v/mil
  • Dielectric Strength (kV/mm)
    2 kV/mm
  • Flowable
    Yes
  • Hydrophobic
    Yes
  • Low Odor
    Yes
  • Nonvolatile Content
    99.7 %
  • Number of Parts
    One
  • Polyesters
    Yes
  • Primerless Adhesion
    Primerless
  • Resistance Type
    Oxidation Resistance, Ozone Resistance, Solvent Resistance, Thermal Resistance, UV Resistance, Water Resistance
  • Temperature Stable
    High, Low
  • Thermal Conductivity
    0.9 Watts per meter K
  • Volume Resistivity
    2e+016 ohm-centimeters
  • Water Resistant
    Yes

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